Mitsubishi Materials’ sintering copper bonding material is essential for attaching semiconductor components. This material is actually created from copper powder. In this issue, we will introduce the unique technology of Mitsubishi Materials that is hidden within this powder.

Bonding material for attaching components is necessary in semiconductors. Mitsubishi Materials produces this material using copper powder with extremely small grains measuring only a few nanometers. Copper’s melting point is very high, exceeding 1000°C, but if it’s in the form of a very small, consistently-sized powder, it actually melts at a lower temperature. Thus, creating the material using powder is easier and more cost effective. By melting the powder into a cream like paste, we can form it into various shapes and sizes, allowing us to bond together semiconductors in a variety of shapes. The strength of copper is greatly demonstrated when used in semiconductors.

Power semiconductors used in electric vehicles (xEVs) and charging equipment can handle electricity surpassing 1 million watts and are bonded on top of electrodes. Therefore, the bonding material used to attach the semiconductors is required to conduct electricity well and withstand high temperatures for extended periods of time. The bonding material Mitsubishi Materials creates from copper powder, a proprietary technology of which we are proud, is high- temperature resistant, making it perfect for power semiconductors. Because copper has a high melting point and high heat conductivity, it has sufficient heat resistance and heat dissipation for even when machines exceed 200°C during operations. Hence, we are able to more safely achieve highly-versatile power semiconductors.