Special feature : Supporting the evolution of automobiles and semiconductors Vol.1
In this issue, we will cover high-performance materials and products, which are widely used for automobiles and electronic devices and maximize their performance. Today, we are witnessing the transition to xEVs (electric vehicles) as well as electrification and IoT implementation to make goods and services work efficiently, toward the realization of a sustainable society. Mitsubishi Materials will adapt to these societal changes through the power of high-performance materials and products.

Accelerated electrification and the reduction of ICE vehicles
The EU has approved a law to effectively end the sale of ICE (internal combustion engine) vehicles in 2035. According to the International Energy Agency (IEA), EVs accounted for 10% of the total new cars sold worldwide as of Decem- ber 2022. The electrification of vehicles is accelerating.

Connected and self-driving cars are coming true
Driverless self-driving taxi services have already been commercialized in the United States and China. In Japan, fully automated driving within specific areas (referred to as “level-4” autonomous driving) was approved by a law revision in April 2023. The self-driving technology we have dreamed of is gradually becoming a reality.

Into an era where everything is connected
In 2025, the world is expected to contain 180 trillion gigabytes of data. This enormous volume of data results from the trans- formation of equipment that was previously not connected to the internet into IoT devices with advanced capabilities. Data has become an essential part of our societal infrastruc- ture.

Into an era where AI is utilized in every scene
AI is part of our daily lives, supporting society by discerning defective products at plants, forecasting supply and demand balances for products and services, and supporting cancer diagnoses based on images of affected areas.
High-performance Products Help Advance Automobiles and Semiconductors
Regarding semiconductors, which control their motion, and the components and parts through which electricity flows, materials and products are required to be more precise than ever and capable of functioning under severe conditions. In other words, the advancement of materials is essential for the evolution of automobiles and electronic devices. Mitsubishi Materials supports this evolution by developing and manufacturing high-perfor- mance products with a wide range of features.
Since xEVs use a significant amount of electricity for power and electronic control, the materials used in them must demonstrate conductivity and heat dissipation properties in all environments. Mitsubishi Materials tackles this challenge through high-quality copper products and alloy metal technology.

The MSP series, widely used for automotive terminals and busbars, are copper alloys that offer both superior electrical conductivity and strength. The materials are suitable for a wide range of applications in next-generation automobiles that incorporate many electronic devices. MSP5, which contains the highest
magnesium content among the alloys in the series, excels in strength, heat resistance, and bendability while meeting the needs for compactness and lightness. When combined with our PIC (Precise Interface Control) Plating technology, it can significantly reduce friction during the insertion of terminals in automotive connectors, and so on. This material also contributes to advancing their functionalities.

GloBrass®, a type of free-cutting brass*1 that does not contain environmentally hazardous substances, excels in both strength and machinability. It is expected to find use in faucet fittings, such as water meters, thanks to its eco-friendly and people-friendly qualities complying with Europe’s ELV directive,*2 RoHS directive,*3 and water quality standards. Given that the material meets the necessary conductivity requirements for electronic and electrical equipment and offers corrosion resistance on par with conventional brass, it is expected to be used in a wide range of applications, including mechanical components in automobiles.
*1 Brass: An alloy of copper and zinc. *2 ELV (End-of-Life Vehicles) directive: A directive set by the EU with the aim of reducing environmental impacts of wasted vehicles.
*3 RoHS directive: A directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment.

Automotive components for next-generation EVs require mateials that can withstand higher current flow and heat dissipation than those for conventional internal combustion cars. This is where Mitsubishi Materials’ MOFC®-HR, innovative oxygen-free copper with world-class strength and heat resistance, comes into play. This material achieves strength and heat resistance on par with copper alloys, while retaining the excellent electrical and heat conductivity of conventional oxygen-free copper. The material is expected to be used for components such as automo-tive high-voltage terminals and busbar modules, which need to support high current flow, dissipate heat effectively, and meet compact and thin size requirements.

Heat management is essential to maintain the functioning of smartphones, which include semiconductors, as well as next-generation vehicles. With an increase in the number of integrated electronic components due to product performance improvements, managing the heat emitted by these components has become crucial. This is where thermistor sensors, which function as temperature sensors, come into action. Mitsubishi Materials’ thermistor sensors provide high-speed responsiveness, high reliability, and high precision in temperature sensing thanks to the proprietary raw materials. Additionally, their structures and forms can be customized to meet various requirements.
Semiconductors control and manage memory in various electronic devices. The completion of integrated circuits (ICs) and central processing units (CPUs), which serve as the brain of computers, involves a wide range of processes. These include not only manufacturing the underlying materials but also creating equipment for manufacturing semiconductor components. Mitsubishi Materials develops and produces materials and processed products used in various applica- tions related to semiconductors.

The solder material bonds a silicon chip and substrate, which form the circuitry of a semicon- ductor component, and serves as the electrode between them. Conventional solder materials emitted alpha rays, which could cause software errors that overwrite stored data. This is why Mitsubishi Materials has started offering plating chemicals and anodes, which are solder materi- als with extremely low alpha-ray emissions.

Lead frames are thin metal plates used for ICs, serving as connecting terminals when ICs are attached and integrated into printed wiring boards. The advancement of the components is supported by our copper alloys for lead frames, which boast a world-class quality achieved through our long-cultivated precision rolling technology. These alloys are widely employed as lead frame materials, harnessing the optimal balance of strength and conductivity, heat resistance, ease of pressing, and bendability.

Some semiconductor manufacturing equipment, such as CVD equipment used to form thin films for protecting semiconductors from water and dust, operates in a plasma*4 environment and needs to withstand it. For this purpose, Mitsubishi Cable Industries, Ltd.’s sealing products are useful. Apart from plasma resistance, the products also prevent the ingress of dirt and dust, which can adversely affect the equipment, and provide antistatic and abrasion resistance. Further product development is ongoing to support various environ- mental regulations.

Processed silicon products play an active role as part of semiconductor manufacturing
equipment. Mitsubishi Materials provides silicon products by precisely processing high-purity silicon to ensure that semiconductor manufacturing equip- ment functions properly.
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