2024.10.07

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Special feature : Evolving copper Vol.2

Create world-class copper products with technology

Mitsubishi Materials’ copper products have continued to evolve with the times and meet the needs of the market and our customers. Here we will look into the strengths of the MSP series and MOFC®-HR, which are our mainstay products.
We spoke with two salespeople who were at the center of sales activities about Mitsubishi Materials’ unique technical capabilities, advantages in the market, and the possibilities of Mitsubishi Materials’ copper products.

MSP series
Pursuing the limits of alloys

Solid solution strengthening that only Mitsubishi Materials could realize
The MSP series, which is utilized in a wide range of applications, was created using a strengthening method known as “solid solution strengthening,” in which magnesium is added to copper. This is a strengthening method that was realized because Mitsubishi Materi- als is skilled in casting techniques.

MSP series usage example: Terminals

Creating joy for the world with one-of-a-kind technologies

Kota Iwai
Group III, Rolled Product Sales Dept.
Sales Unit
Copper & Copper Alloy Business Div.
Advanced Products Company

The automobile industry is facing a major turning point with the shift to electric vehicles. As they are equipped with autonomous driving functions, the shift toward greater functionality and higher performance is unstoppable for automotive electronics and electrical equipment. As a result, there is an increased need for materials that make electrical conductivity and miniaturization possible. I conduct sales to design departments of major automotive wire harness manufacturers, which leads to orders for our materials, such as those in the MSP series.
Of those products, MSP5 is a unique material that has a cost advantage for customers purchasing based on weight as it has a lower relative density due to its higher volume of added magnesium. It has also been well received by our customers at press manufacturers as it is easy to process.
There are other excellent products  in the market as well. Despite this, the MSP series has been adopted because it contains “joy.” The MSP series has  the potential to evolve even further and become a global competitor. In order to further expand the market, we will build a global supply system and expand sales of this material as a way to bring joy to the world.

MOFC®-HR
Pursuing the limits of strength

Oxygen-free copper that can be used even in harsh environmental conditions
MOFC®-HR was created through the hard work of researchers, our proprietary technical capabilities that increase the strength of copper, and control technology for added elements. Because of our oxygen-free copper manufacturing technology and material design technology, our oxygen-free copper has dramatically enhanced strength and heat resistance while maintaining high levels of electrical and thermal conductivity. It can be used in a wide range of applications as there is little deterioration of its characteristics even in environments with high heat loads. It is optimal for components in electrical equipment that require high currents and high levels of heat dissipation in harsh environmental conditions, such as electric vehicles and next-generation energy.

MOFC®-HR usage example: Connectors

Leveraging strength and heat resistance to meet needs in Japan and overseas

Mitsuru Ohashi
Group I, Rolled Product Sales Dept.
Sales Unit
Copper & Copper Alloy Business Div.
Advanced Products Company

MOFC®-HR is an alloy that enables thin- ner and smaller oxygen-free copper than what can be realized conventionally. Developed at the Copper & Copper Alloy Development Center, which is responsible for metal material R&D, it underwent a number of prototyping phases to enhance the strength and heat resistance of oxygen-free copper, coinciding with the growing shift to- ward electric vehicles and the need for next-generation energy sources.
I conduct sales of automotive alloys primarily to major connector manufacturers in Japan and overseas. I’m currently focusing on the power module market for semiconductors. Cometition is fierce and new alloys are not likely to be adopted, but recognition of MOFC®-HR has increased recently, which I see as an opportunity. In the semiconductor market, adoption often spreads horizontally, so by understanding the needs of the development team and the market, we will gain the trust of our customers.
In the European and North American markets, we are working with our German marketing team to deepen relationships with local customers and are seeing an increase in business. Going forward, we will enhance our track record and establish our position as the Global First Supplier.