Semiconductors are essential for our current lifestyle. In the field of semiconductors, which is evolving at a remarkable speed, the required specifications, characteristics, and materials for the technology are continuing to change. Amidst these circumstances, Mitsubishi Materials provides a low alpha plating chemical as a bonding material for semiconductor devices.
Alpha ray radiation has an adverse effect on the performance of semiconductor devices, causing soft errors and other problems. The key to reducing alpha ray radiation depends on how much we can reduce trace amounts of radioisotopes, which are included in semiconductor materials. We started developing low alpha materials about 30 years ago, resulting in a reduction in radioisotopes and the establishment of measurement and management technology. With a focus on plating chemicals, we provide a number of low alpha products to the industry.
Because plating chemicals are easily compatible with smaller sizes when forming electrodes, there has been an increasing dominance in semiconductor devices, which have become smaller and highly integrated. We will contribute to realizing a prosperous society by making use of the technology that we have cultivated and providing products that will play a part in the evolution of semiconductors.

Mitsubishi Materials has been developing the low alpha material series, “MULαS,” for about 30 years. The series is used for bonding semiconductor devices to circuit boards and provides optimal implementation solutions for cutting-edge semiconductor packages that are highly integrated.