Equipped with social infrastructures such as smartphones, automobiles, and the internet, semiconductors are essential to our daily lives. Mitsubishi Materials’ high precision and small parts machining tools are used to manufacture components of semiconductor manufacturing equipment.
High precision and small parts machining is the processing of metals with cutting tools to create small and precise components. We entered this field in 2002 by focusing on automatic lathes, a kind of machining tool that was relatively unknown at the time. We then gradually expanded our product range with our industry’s leading coating and material processing technologies. We have delivered high-quality products that cater to customer needs through development elaboration and thorough quality management after production. Our products are being utilized in various industries, including the automobile and medical fields. Going forward, we will aim to develop in the semiconductor field, which is experiencing a growing demand, by providing high-value cutting tools.

Cutting tools’ wear resistance and fracture resistance is a trade-off. Increasing either of them will decrease the other. However, “MS9025” has achieved high performance in both of them. It realizes long tool life and contributes to reduced production costs and improved quality.